PEMTRON announces its participation at the TPCA Show, scheduled for 22-24th October 2025, at the Taipei Nangang Exhibition Center. Visitors can find PEMTRON at Booth K-1411, where the company will highlight two of its most advanced inspection solutions: the POSEIDON wafer warpage and bump inspection system and the 8800AI intelligent visual inspection platform.
POSEIDON: precision wafer warpage and bump inspection
The POSEIDON system delivers highly accurate measurement of wafer warpage, flatness, and FC-BGA bump coplanarity – key parameters for processes such as wire bonding and Micro LED assembly. In addition, POSEIDON captures fine surface defects, including microcracks, missing bumps, and bridging. With rapid 3D data acquisition and real-time analysis, the system empowers manufacturers to maintain tight process control and minimise the risk of early-stage defects impacting downstream production.
8800AI: intelligent visual inspection for FC-BGA and PCBs
The 8800AI is PEMTRON’s intelligent visual inspection solution designed for FC-BGA and a wide range of PCB applications. Leveraging advanced algorithms and artificial intelligence, the system detects defects such as foreign materials, stains, and scratches – improving first time yield (FTY) rates significantly. Powered by PemBrain AI, the 8800AI enables full inspection of both the top and bottom of PCBs via an integrated automated logistics system. Live demonstrations at the booth will showcase the 8800AI’s ability to elevate quality control and enhance production efficiency.
