The seminars will take place during May, June and July in 20 convenient city locations in France, Germany, Italy, the UK, Sweden, Finland, The Netherlands and Spain.
Technical presentations will be provided by experts from Future Electronics’ specialist Future Connectivity Solutions division, and from ARM, IBM, NXP Semiconductors, STMicroelectronics and others.
Each event will also feature a lunchtime technology fair featuring demonstrations from Future Electronics’ franchised suppliers.
Visitors to the seminars will learn the criteria for choosing the best sensor for an IoT node, how to protect edge nodes against post-deployment hacking and exploitation, how to commission edge nodes securely and easily and the best choice of short- and long-range wireless technologies.
Also on the agenda will be how to implement and deploy gateways, the benefits of the ARM® mbed platform for connecting nodes to the cloud easily and securely and the business and user benefits to be derived from the analysis of cloud-based data