Events News

Online ASIC design solution debuts at Sensor + Test

21st May 2018
Mick Elliott

Visitors to the Swindon Silicon Systems stand at Sensor + Test 2018 in Nuremberg (June 26-28) can be the first to use Swindon’s new on-line IC Builder. At the show, Swindon will be discuss the many advantages of Application Specific Integrated Circuits (ASICs) and integrated MEMs sensor interface solutions, System on Chip (SoC) as well as System in Package (SiP) devices designed by the company to be at the heart of today’s intelligent sensing solutions.

A growing number of companies across many sectors are realising the many advantages these single package electronic systems can offer and they will see in IC Builder a new way for designers to visualise what their ASIC solution may look like for their application and to informally discuss with Swindon what they need their ASIC to do.

In most designs, a new single IC device will be taking the place of a variety of standard components normally mounted together on one or more printed circuit boards.

Functions will normally include processing, memory, digital and analogue conversion, sensing, filtering, communication, protection, and power management.

Click by click, IC Builder allows the user to progressively add the functions required for their intelligent sensing application and the capability to see what the resulting package could look like.

Designers can add processors including ARM Cortex and Intel 8051, a choice of memory type – Flash, EEPROM, ADCs, DACs, low and band-pass filtering, sensors – including photodiode and temperature, frequency generators, RF and a choice of communication protocols.

They can also choose from several actuation device types including full bridge, gated drivers as well as low and high side drivers.

Power management by DC/DC converters or voltage regulators is selectable as is the type of protection required – such as EMC and surge and reverse polarity.

Finally, users can choose the operating voltage level for the device.

Once all the functions needed have been added, a single click will let the user see the package and its dimensions needed for their specific application.

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