Most of these failures can be detected with 2D inspection; however, sometimes it is necessary to use other techniques such as X-Plane (Tomosynthesis) and CT. Also, Koch will discuss how the shape of the BGA balls or the voiding can give a good indication of the failure.
The presentation will analyse failures on different components such as resistors, capacitors and wire bonds. Nordson DAGE X-Plane and CT-images will be shown. Koch will conclude with an example of how useful X-ray can be to find a manipulation on a device.
