Nordson YESTECH to exhibit AOI in-line PCB inspection system
At SMT/Hybrid/Packaging 2015, which takes place from 5th to 7th May at the Messe in Nuremberg, Germany, Nordson YESTECH will showcase its FX-940 AOI in-line PCB inspection system for the first time in Europe. The company will be situated at booth 7A-131.
The PCB inspection system offers the latest multi-dimensional technology for the inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices. Featuring advanced Fusion Lighting and a comprehensive set of inspection tools, including angled cameras, 3D height sensors, full colour digital image processing and both image- and rule-based algorithms, the FX-940 is unsurpassed in defect detection.