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Nordson to feature test and inspection systems at SMTA experience

18th September 2015
Siobhan O'Gorman

Nordson DAGE and Nordson YESTECH, divisions of Nordson, are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from 29th to 30th September 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It also will include AOI inspection of PCBAs for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show the machines' capabilities.

Bob Willis will use the Nordson YESTECH BX AOI system and Nordson DAGE XD7500VR Jade FP among other leading equipment to inspect process defects. The Nordson YESTECH BX AOI benchtop platform offers off-line benchtop PCB inspection with exceptional defect coverage. The Nordson DAGE XD7500VR Jade FP X-ray inspection system uses the latest technology flat panel detector to provide a market-leading, cost-effective approach where high quality real-time imaging is needed for production tasks.

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