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Next gen networks supported at Aircraft Interiors Expo 2017

21st March 2017
Lanna Deamer



Molex will focus on next gen cabin network systems at the Aircraft Interiors Expo to be held at 4th to 6th April in Hamburg, Germany.

Engineers continue to strive to reduce aircraft weight and costs, while enhancing safety, functionality and the passenger experience. Visitors to the Molex stand (2B09) will have the opportunity to explore the extension of Mini MRP Modules for copper and optical solutions delivering the smallest footprint possible for EN4165 mateable modular rack connectors, saving valuable PCB space.

A key feature is the angled rear insulator design that protects contacts from pull-out and torsion, dispels capillary forces and improves accessibility and application of hydrophobic protective coating. This serves to eliminate the problems associated with the ingress of dew and enables much more efficient inspection and maintenance as compared with its ARINC 836-compliant counterparts.

As a supplier of advanced fibre optic components, Molex will also be showcasing its extensive Fibre Optic product offering to draw the path to future Optical Grid Networks in aircrafts. Besides optical connectors and adapters, optical assemblies, optical backplanes, optical circuitry, termination kits and tooling, Molex's experience and resources encompass a wide range of design, manufacturing and value-added services.

In the area of miniature computing, Molex will introduce the ePC-nano embedded computer and Cardsharp single board computer from its subsidiary, Innovative Integration. Experts in data acquisition, Innovative Integration designs embedded electronics with digital and analogue interfaces and FPGAs for digital signal processing, software radio and data acquisition applications used in rugged environments.

In addition, Molex will present solutions for in-seat wiring and Copper Flex and Printed Circuit solutions for aircraft electronic and electrical systems.

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