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MIRTEC to exhibit at SMTA International

25th August 2015
Siobhan O'Gorman


At SMTA International, which takes place from 29th to 30th September at the Donald Stephens Convention Center in Rosemont, IL, MIRTEC will exhibit its 3D AOI and SPI systems. The company will be situated at booth 407.

The MV-6 OMNI 3D in-line AOI machine is configured with MIRTEC’s OMNI-VISION 3D inspection technology which combines the 15MP CoaXPress vision system with the company’s digital multi-frequency quad moiré 3D system in a cost-effective platform.

MIRTEC’s 15MP CoaXPress vision system is a proprietary camera system designed and manufactured for use with the company’s complete product range of 3D inspection systems. MIRTEC’s digital multi-frequency quad moiré technology provides true 3D inspection using a total of four programmable digital moiré projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the MIRTEC MV-6 OMNI machines feature four 10MP side-view cameras in addition to the 15MP top-down camera.

MIRTEC’s MS-11E 3D in-line SPI machine will also be on display. This is configured with the company’s 15MP CoaXPress vision system, providing enhanced image quality, high accuracy and fast inspection rates. The machine uses dual projection shadow free moiré phase shift imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11E uses the same robust platform as MIRTEC’s MV-6 OMNI series.

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