Highlighted products will include the versatile Array Package Rework systems, which provide repeatability, accuracy and thermal control for safe and effective rework of BGA, CSP, LGA, micro SMD, MLF and bumped chip component packages.
Metcal will also display the MX-5200 soldering, desoldering and rework series. Featuring dual-simultaneous ports, the dynamic option enables the two hand-pieces to share 80W based on demand, increasing flexibility and speed.