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Maxim lines up new products, demos for electronica 2020

29th October 2020
Mick Elliott

Maxim Integrated will be showing new products as well as hosting demos and webinars on its stand at the virtual electronica 2020 (November 9-13).

Visitors will be able to dive into demos, and gain deeper insights into technologies through a series of webinars, and meet with the Maxim team.

Topics include industrial, healthcare, essential analogue, mobile power, cloud and data centre, micros and security and design tools.

Maxim’s Virtual electronica demos include:

  • Building Automation with Go-IO
  • Factory Automation with Go-IO
  • Intelligent Sensors for Industrial Automation
  • Motion Control by Trinamic
  • Himalaya DC-DC Converters—The Peak of Cool
  • Protect Your System from Current, Voltage, and Temperature Excursions
  • DC-DC Isolation with Lower Cost While Saving Space

Webinar topics are

  • New IO-Link Transceivers Make Sensor and Actuator Designs Easier
  • The Latest Technologies in Driving Stepper Motors
  • Create Cooler, Smaller and Simpler DC-DC Power Supply Solutions Without Being an Expert
  • Protect Your Power System Designs Against Faults Like a Pro
  • How to Increase Runtime and Reduce Size of Solar-Powered IoT Devices

Centre stage will be two products recently introduced by Maxim.

Modern smart factories need to quickly and remotely adjust a sensor’s electrical characteristics to minimise downtime and maximise throughput.

The MAXREFDES177# IO-Link reference design demonstrates the flexibility of the MAX22515 IO-Link transceiver, configuring all modes of the MAX22000 software-configurable analogue IO. This chipset provides flexibility with faster reconfiguration to reduce factory downtime.

A chipset solution of MAX22000 and MAX22515 builds upon the benefits of IO-Link’s two-way universal interface. The IO-Link interface allows every IO-Link sensor, actuator or IO expansion module to be interchangeable to a standard hardware interface. It also provides software-defined performance parameters and selectable analog input or output performance modes. These software-selectable capabilities are combined and demonstrated in the MAXREFDES177# IO-Link reference design.

The MAX22000 is a software-configurable analogue IO provides up to more than half the power savings and approximately half the size compared to the closest competitive solutions on the market. Key functions integrated include a 24-bit ADC analogue input mode and an 18-bit DAC analogue output mode, as well as operations over either a single 2-wire interface or a 4-wire resistance temperature detector (RTD)/thermocouple temperature measurement.

The MAX22515 is said to be the industry’s smallest ±1.2kV/500Ω surge-protected, single-channel IO-Link transceiver. It features high integration with protection diodes, auxiliary digital input, I2C or pin control, integrated oscillator and selectable 3.3V or 5V LDO which help to provide high configurability and reduce SKU.

It enables half the power dissipation due to low 2.2Ω or 2.65Ω (typ) C/Q driver on-resistance compared to the closest competitor, in the smallest 2.5mm x 2.0mm WLP package. It cuts the solution size up to 67 % compared to the closest competitor and fits into small, space-constrained IO-Link sensors or actuators.

Also on parade will be Maxim’s Health Sensor Platform 3.0 (HSP 3.0) which it says saves at least six months of development time.

Also known as MAXREFDES104#, the ready-to-wear wrist form factor reference design monitors blood oxygen saturation (SpO2), electrocardiogram (ECG), heart rate (HR), body temperature and motion.

Included algorithms provide HR, heart-rate variability (HRV), respiration rate (RR), SpO2, body temperature, sleep quality and stress level information at clinical-grade levels.

It allows wearable designers to start collecting data immediately, saving at least six months over building these devices from scratch. Designed for wrist-based form factors, HSP 3.0 can be adapted for other dry electrode form factors such as chest patches and smart rings.

Compared to its industry-leading predecessor, Health Sensor Platform 2.0 (HSP 2.0), the HSP 3.0 adds optical SpO2 measurement and dry-electrode capability to the ECG. As a result, it can enable end solutions to monitor cardiac heart and respiratory issues for management of ailments like chronic obstructive pulmonary disease (COPD), infectious diseases (e.g. COVID-19), sleep apnea and atrial fibrillation (AFib).

Compared to its predecessor, the narrower form factor and enhanced optical architecture of HSP 3.0 improves signal acquisition quality and uses upgraded microcontroller, power, security and sensing ICs. The reference design includes complete optical and electrode designs, along with algorithms to meet clinical requirements.

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