Japan’s Advantest targets AI and HPC markets with new semiconductor test platforms

Advantest Corporation, the Tokyo-listed semiconductor test equipment maker, is sharpening its focus on the artificial intelligence (AI) and high-performance computing (HPC) sectors with the launch of a new generation of test platforms to be unveiled at SEMICON West 2025 in Phoenix this week. Advantest Corporation, the Tokyo-listed semiconductor test equipment maker, is sharpening its focus on the artificial intelligence (AI) and high-performance computing (HPC) sectors with the launch of a new generation of test platforms to be unveiled at SEMICON West 2025 in Phoenix this week.

Advantest Corporation, the Tokyo-listed semiconductor test equipment maker, is sharpening its focus on the artificial intelligence (AI) and high-performance computing (HPC) sectors with the launch of a new generation of test platforms unveiled at SEMICON West 2025 in Phoenix this week.

The company, one of the world’s leading suppliers of semiconductor test systems, will showcase solutions aimed at tackling the growing complexity of chip design and manufacturing across AI, 5G, automotive, and memory applications. The products are designed to support faster, more reliable testing as the semiconductor industry faces mounting pressure to improve efficiency and time-to-market.

Advantest’s display will feature a broad portfolio of systems and software, including the V93000 EXA Scale SoC test platform, the HA1200 die-level handler with active thermal control, and the T5801 Ultra-High-Speed DRAM test system, which supports next-generation memory standards such as GDDR7, LPDDR6, and DDR6.

Other highlights include SiConic, a scalable validation platform for complex systems-on-chip (SoCs), and new System-Level Test platforms offering cost-effective structural test coverage. The company will also introduce the 7038 Single Test Rack, designed to handle high-power, large-package devices within a smaller footprint.

Advantest has extended its flagship V93000 system through a collaboration with FormFactor, enabling high-volume testing of silicon photonics and co-packaged optics devices — technologies that are expected to play a key role in the next generation of data centre and communication hardware.

Its ACS Real-Time Data Infrastructure (ACS RTDI) platform will also be on display, allowing manufacturers to convert test insights into actionable process adjustments in milliseconds, thereby optimising yield and reducing production delays. Additional exhibits include CREA’s power semiconductor testing systems, targeting SiC and GaN devices used in electric vehicles and industrial equipment, as well as the T2000 SoC systems with a Rapid Development Kit for automotive and power analogue devices.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post
Breakthrough in LEO satellite IoT connectivity for remote regions

Breakthrough in LEO satellite IoT connectivity for remote regions

Next Post
Solderable, board-mount replacement for traditional contactors

OMRON reveals 300A/1000V power relay with auxiliary contact