Interface analysis software on show at SMTAI 2014
Exhibiting in Booth #541 at SMTA International 2014 will be Akrometrix, with the company planning to demonstrate their Interface Analysis software. The software allows allow high-level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analysed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing features such as Pass/Warning/Fail maps, and graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.
SMTA International is scheduled to take place between September 30th and October 1st, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
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