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Interconnect solutions to be showcased at Industry 4.0

5th April 2017
Lanna Deamer
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Molex will present interconnect solutions, as part of its platform for industrial automation, to help customers address Industry 4.0 applications at Hannover Messe 2017 (Hall 9, Stand F76).

Already recognised as offering the largest portfolio of connectivity and wiring solutions for harsh environments, including automotive manufacturing, food and beverage processing, machine building, and materials handling and packaging, Molex is increasingly focused on providing solutions which add intelligence, communications and networking to the production process, supporting the Industry 4.0 drive towards smarter machines and factories.

Together with MB Connect Line, Molex will also debut its remote access capabilities at the show. With connectivity and data transparency becoming critical, Molex and MB Connect Line will introduce a secure and reliable cloud-based communication channel that enables remote access and monitoring.

As Industry 4.0 seeks to improve efficiency, increase flexibility and accelerate time-to-market, enabled through integration of smart devices and the IoT, one example of this in action is maximising system availability through remote condition monitoring and predictive maintenance. This allows machine and system builders to deliver added value to customers and re-think traditional business models through servitisation.

A live machine on the Molex stand will demonstrate a complete solution, integrating and combining multiple industrial interconnect solutions, including a range of active and passive I/O, rugged, secure and reliable Brad connectors and Flamar cables for industrial automation, with remote access technologies and communication protocols, such as IO-Link, Ethernet/IP and PROFINET.

Customers will also be able to test the patented push-to-lock technology of the Brad Ultra-Lock Connection System, experiencing for themselves how it surpasses the performance and reliability of traditional threaded connectors.

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