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Indium to present on alternative solder alloys at SMTA

14th May 2024
Sheryl Miles

Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16th May 2024 in Aurora, Colorado.

The presentation, ‘Exploring Alternative Solder Alloys and Their Beneficial Attributes’, will examine alternative alloys with enhanced reliability performance.

As the industry continues to move towards reducing costs in components, substrates, and energy consumption by lowering soldering temperatures, alternative solder alloys are explored to follow this trend. Developments of a low-temperature alloy and/or high-reliability alloy are created through a patented mixed alloy technology when the traditional SAC305 alloy isn’t enough.

“These alternative solder alloys offer enhanced reliability in drop shock performance, thermal cycling, and creep fatigue,” said Nguyen. “Both alloys demonstrate similar or better characteristics than SAC305. We can use this knowledge to our advantage when exploring other alloy options.”

As a Technical Support Engineer, Thuy Nguyen provides leading-edge technical support to customers and potential customers in the Southwest US and the Rocky Mountain region. She is responsible for resolving complex solder process challenges. She also assists customers with optimising their use of Indium Corporation’s soldering materials and offers training. She is based at Indium Corporation’s global headquarters in Clinton, NY.

Thuy joined Indium Corporation in 2015 and has held roles in quality, R&D, and manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in implementing new processes and training materials. Thuy holds a bachelor’s degree in chemistry from Utica College. She is also a Certified SMT Process Engineer (CSMTPE).

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