A key highlight is Indalloy301 LT, a novel bismuth-free alloy tailored for power module package-attach applications. This alloy is engineered to prevent thermal defects in modules without compromising reliability, unlike traditional bismuth-containing, low-temperature alloys.
Indalloy301 LT, available in InFORMS configurations, offers a consistent bondline thickness and enhanced strength, thereby improving both thermal and mechanical reliability of solder joints. It also reduces processing temperatures and energy input during manufacturing. This innovation allows for the use of other Pb-free high-reliability alloy technologies, such as Indalloy276, in power module die-attach, component-attach, or interconnects, eliminating the risk of re-melt and performance degradation. Indalloy301 LT is also offered in preforms and ribbon configurations, either flux-free or with Indium Corporation’s flux coating technology.
Furthermore, Indium Corporation, leveraging its extensive experience in the automotive industry and its award-winning product range, will showcase:
- InFORMS: Reinforced solder alloy fabrications that enhance mechanical and thermal reliability. These are specially designed to maintain consistent bondline thickness in power module applications and provide improved materials for more reliable, high-performance modules.
- InTACK: A halogen-free, no-clean, no-residue adhesive solution, ideal for holding components in place during placement and reflow processes. Suitable for no-flux reflow applications with formic acid, InTACK offers high tack to secure a die, chip, or solder preform, reducing reliance on tooling without affecting soldering or sintering quality.
- QuickSinter: A novel sinter technology approach featuring high-metal, low-organic content for rapid drying and sintering. Available in both silver and copper sinter pastes, this range includes the InFORCE series of pressure sinter pastes and the InBAKE range of pressure-less sinter pastes, suitable for die-attach and substrate-attach in power electronics.
- Durafuse HT: A unique tin-rich, high-temperature lead-free (HTLF) paste based on novel alloy technology. Durafuse HT offers simple processing without the need for special equipment and provides thermal cycling reliability on par with or superior to high-Pb solder.
- Indium8.9HF Solder Paste Series: A well-established solder paste series, providing no-clean, halogen-free solutions. These pastes are designed to achieve high surface insulation resistance (SIR) and enhance stability during the printing process, specifically for high-reliability automotive electronics.
- Heat-Spring: A compressible, non-reflow metal Thermal Interface Material (TIM) suitable for TIM2 applications. Containing indium, these TIMs offer exceptional thermal conductivity over non-metals, with pure indium metal providing 86W/mK in all planes. Heat-Spring avoids pump-out and bake-out issues due to its solid metal state and supports sustainability through Indium Corporation’s indium reclaim and recycle program.
