Events News

Indium Corporation power electronics at NEPCON Japan

16th January 2024
Harry Fowle
0

Indium Corporation will showcase its advanced assembly materials for power electronics, including the rapidly evolving EV manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan.

Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Featured products include:

  • InFORMS – reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
  • Indalloy301 LT Alloy for Preforms/InFORMS – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS.
  • Durafuse HT – based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
  • Durafuse HR – based on a novel alloy technology, delivers enhanced thermal cycling performance (-40/125°C and -40/150°C) and superior voiding performance for high-reliability automotive applications.
  • Heat-Spring  – a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to our indium reclaim and recycle program.

Many of these innovative products are counted within the company’s Rel-ion suite of electrical, mechanical, and thermal solutions to reduce EV manufacturers’ time to market. More than five million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion materials solutions deliver reliability by:

  • Eliminating non-wet opens and head-in-pillow defects
  • Preventing dendritic growth by meeting stricter surface insulation resistance requirements
  • Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
  • Reducing hot spots-induced voiding through improved thermal efficiency

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier