Indium will feature a range of sustainable, high-reliability solder products at productronica India, running 17-19 September in Bengaluru, India.
Indium’s solder and alloy technologies are designed to meet the stringent requirements of the EV market, where thermal management, reliability, and energy efficient are necessities. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry’s drive towards sustainability and longer-lasting products.
The company will showcase the following:
- Durafuse HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength
- Durafuse LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is well suited for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup
- Indalloy303, or Bi+, is an innovative low-temperature solder developed to meet the challenges of modern electronics manufacturing. Featuring a unique doped bismuth composition, Bi+ delivers outstanding reliability and performance for sensitive components that demand precise thermal management. With enhanced thermal cycling capabilities and compatibility with Indium Corporation’s low-temperature flux technologies, Bi+ sets a new standard in the soldering industry
- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow
- CW-807RS is a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
- InFORMS are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications
