Events News

In vehicle communication networks at AEC 2020

5th February 2020
Alex Lynn

Molex has announced that it will showcase next-generation Ethernet capabilities for the connected and autonomous car at the sixth annual Automotive Ethernet Congress (AEC) being held February 12th and 13th, 2020 at The Westin Grand, Munich, Germany.

Molex will also present on the impact of merging in vehicle communication and how networks can meet future demand for adaptive applications for the connected and autonomous vehicle.

“The automotive industry is under a tremendous transformation and challenged to meet requirements for in-vehicle communications such as adaptive applications,” said Michael Potts, Lead System Architect, Molex. “Molex Ethernet in-vehicle network communications solutions are the building blocks to support adaptive awareness and applications in the software-defined vehicles of the future.”

As an active participant and leader in Ethernet standards alliances including IEEE 802 TSN, Security and IEEE 802.3 Task groups, Mike was the initial developer and a key driver for the IEEE 802.1DG TSN Profile for the draft standard of the Automotive In-Vehicle Ethernet Communications Profile. At AEC 2020 he will deliver a presentation titled ‘Meshing of the Networks’ which explores the impact of merging in-vehicle communications networks and strategies to design and develop next-generation adaptive applications.

“The future of software-defined in-vehicle communications networks demands a system-level approach that will allow for the merging of current vehicle functional requirements with new adaptive applications with increased data traffic requiring smaller more precise deterministic signalling and near zero end-to-end latency expectations,” added Potts.

Molex has developed next-generation Automotive Ethernet Network Platform delivering a complete vehicle ecosystem with seamless multi-zone integration across hardware, software and interconnect cabling system—and the scalability needed for future upgrades.

Featured products

Product Spotlight

Upcoming Events

View all events
Latest global electronics news
© Copyright 2021 Electronic Specifier