IC test solutions centre stage at SEMICON China 2021
Semiconductor test equipment supplier Advantest will feature its newest products and solutions for advanced ICs at SEMICON China (March 17-19) at the Shanghai New International Expo Centre (SNIEC).
Under the new theme, “Converging Technologies. Advancing the Future.”, Advantest will showcase its technology leadership by exhibiting more than a dozen test solutions that contribute to accelerating the development of revolutionary applications such as AI, exascale computing, 5G and ADAS/autonomous driving.
On its booth Advantest will demonstrate a wide variety of test solutions and services will be featured through product demonstrations and digital graphic presentations including the V93000 EXA Scale SoC test system, which is capable of testing digital ICs up to the exascale performance class.
Three new modules to enhance T2000 platform capabilities will be on parade ‒ the 4.8GICAP CMOS image capture module, the 500MDM digital module and the DPS32A power supply module.
Also new is Advantest Cloud Solutions, the state-of-the-art, cloud-based data analytics ecosystem enabling users to manage test and equipment data, and providing easy access to cloud-based applications and infrastructure.
Other debut makers are the H5620 high-productivity memory tester that integrates burn-in and memory-cell test functions in one system, and the TS9001 terahertz analysis system for measuring IC mould thickness and the wiring quality of IC packages and printed circuit boards.
Visitors will also see the V93000 Wave Scale Millimeter solution to cost-effectively test 5G-NR mmWave devices up to 70 GHz alongside the highly flexible T5830ES engineering station, whose Tester-per-Site design enables it to conduct testing across a wide range of flash memory devices.
Other products on display include the T5503HS2 test system for ultra-high-speed memory ICs including next-generation LP-DDR5 and DDR5 devices, B6700 product family of burn-in memory testers and the MPT3000 series test system that combines thermal-control capability with high throughput, enabling extreme thermal testing of solid-state drives (SSDs) including PCIe Gen 4.
Advantest is a Platinum Sponsor of the SEMI Industry Gala on March 17, and a Gold sponsor of the China Semiconductor Technology International Conference (CSTIC) taking place March 14-15 at the Shanghai International Convention Center.
Held in conjunction with SEMICON China, Advantest will deliver four presentations at CSTIC Symposium VI: Metrology, Reliability and Testing on March 15:
- “An Efficient Way of Developing 5G MIMO Transceiver Test on ATE,” Hao Chen, Advantest (China)
- “Complex Protocol Construct System on ATE Platform,” Xin Song, Advantest (China)
- “Test Challenges for 5G Wireless Base Station Application Device,” Xin Song, Advantest (China)
- “Universal Semiconductor ATPG Solutions for ATE Platform under the Trend of AI and ADAS,” Qimeng Wang, Advantest (China)
In addition, Kevin Yan, senior technical expert, Advantest (China), will present “Test Evolution for Heterogeneous Multi-chip Integration”at the Advanced Packaging Forum to be held at the Kerry Hotel Pudong on March 18, 2021.