IBL Löttechnik will unveil a new software suite designed to tighten process control and monitoring in vapour phase soldering at productronica 2025 in Munich, as manufacturers face rising demands for reliability, traceability, and automation in electronics production.
The Advanced Process Control package, which integrates a new Advanced Process Monitoring tool, centres on an Automatic Gradient Control function.
Olaf Cieply, the company’s Global Sales Manager, said the feature allows users to define temperature gradients and hold times directly, avoiding the need for complex programming. He added that the system enables operators to build soldering profiles more intuitively, ensures consistent results across varying assembly types, and reduces the risk of user error.
The monitoring platform tracks key parameters in real time, recording and analysing data on factors such as preheating duration, soldering time, and vacuum pressure. According to Cieply, the system can identify deviations immediately, allowing operators to intervene early in order to maintain soldering quality. The company said the documentation generated by the system meets certification requirements for standards including IPC and ISO, while also ensuring full traceability for each production run.
IBL, founded in 1987, was an early mover in vapour phase soldering technology as surface-mount techniques spread across the electronics industry. The firm holds more than 30 patents in the field and has previously been recognised by the Bavarian state government for its innovations.
