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Highlights of next-gen data centre connectivity at DesignCon 2017

24th January 2017
Anna Flockett

It has been announced that TE Connectivity (TE) will showcase its latest products and innovations at DesignCon 2017, the premier conference for chip, board and systems design engineers, from 31st January – 2nd February, in Santa Clara, California.

With innovations like cloud computing and streaming video, the world continuously creates and consumes more data at a faster speed. Data centres are now more important than ever before, and the technologies that enable scalable, responsive design are vital in keeping the world’s data flowing uninterrupted.

During DesignCon, TE's experts will share their insights on building the next generation of data centres, and examples of how TE is enabling higher-performing designs in smaller spaces. Nathan Tracy, TE Technologist of System Architecture, will participate in a panel to discuss the next wave of electrical interfaces at 4:45p.m on 31st January.

TE’s booth will also feature a variety of products that enable agile design across server, switching and storage applications. The products address several key areas of advancement:

TE will showcase products that meet the needs for faster data rates and decreasing signal rise times. STRADA Whisper high-speed backplane connectors operate with extremely low noise, low insertion loss and little to no skew, delivering at 56Gbps and beyond.

TE will demonstrate solutions that allow increased performance without increasing rack unit space. The microQSFP high-speed I/O solutions enable up to 33% increased density with improved thermal performance.

Improved signal performance is also a key area. New Sliver Internal Cabled Interconnects enable extended reach at 25Gbps for on-board or embedded applications.                        

TE’s product experts will also be available for one-on-one interviews at booth 817 throughout the show to discuss the next generation data centre solutions that meet data centres’ growing needs.

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