Events News

Explore 3D inspection systems for the electronics industry at APEX

13th January 2017
Anna Flockett

It has been announced that Viscom will be exhibiting at the 2017 IPC APEX EXPO, taking place 14th-16th February 2017 at the San Diego Convention Center in California. Visit Booth 3121 for demonstrations of Viscom’s complete lineup of 3D inspection systems for the electronics industry.

The portfolio includes Solder Paste Inspection (SPI), Automatic Optical Inspection (AOI), and X-ray systems (AXI/MXI) with micro-computed tomography (µCT) for the highest defect coverage.

Viscom’s X7056 offers top-of-the-line 3D optical and simultaneous 3D X-ray inspection. With optical inspection resolution up to 8µm and X-ray inspection resolution from 5-20µm, shorter handling time and Viscom’s EasyPro user interface, this in-line system sets a new standard in quality assurance.

Additionally, the new 360View, showing best-in-class 3D AOI image quality, will be demonstrated on the S3088 ultra blue. The highly standardised and economic AOI system offers five camera views including 3D inspection.

For electronics manufacturers, the S3088 ultra blue is the perfect solution to ensure that IPC standards are met. To meet the needs of all customers, (e.g. nine views and higher throughput) the models S3088 ultra, S3088 ultra goldand S3088 CCI are available and will be displayed at the show.

Product Spotlight

Upcoming Events

View all events
Latest global electronics news
© Copyright 2024 Electronic Specifier