EuMW 2023: Microelectronics packages lower cost of space missions
In the fast-paced commercial aerospace market, companies need materials that are both lightweight and durable enough to withstand hostile, demanding environments.
At European Microwave Week in Berlin (September 19-21) SCHOTT unveiled new lightweight microelectronic packages to meet this challenge.
The company’s hermetic packages weigh up to two-thirds less than conventional microelectronic packages made of kovar.
Made of aluminium, the new packaging is designed to protect against the harsh environments of aviation and space.
The lightweight microelectronic packages can be used as microwave / RF packages, DC/DC converter packages, and hermetic sensor packages, especially in aircraft and satellite applications.
SCHOTT says this product will help lower the cost of aviation and space missions.
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