Electronic Specifier’s top news from CES 2024
Electronic Specifier takes a look at some of the top announcements to come from CES 2024, in Las Vegas.
Hailo showcased the future of Edge AI at CES 2024
Hailo's Hailo-8 AI accelerators and Hailo-15 AI vision processors, designed with an AI-first approach, enhance data centre-class AI processing on Edge devices. This technology significantly boosts inference performance, accuracy, and efficiency while minimising power consumption.
At CES 2024, Hailo displayed its technology in action through various partner solutions, including smart cameras by Truen and Gunsens powered by Hailo-15, and diverse security, video management, and automotive solutions driven by Hailo-8 AI accelerators.
KYOCERA AVX new automotive antennas at CES 2024
KYOCERA AVX has released the new A-Series low-profile, surface-mount automotive antennas at CES 2024 in Las Vegas.
The new A-Series low-profile SMT antennas are qualified according to AEC-Q200 standards and offer the industry’s widest range of AEC-Q200-compliant antennas for automotive applications, including wireless battery management systems, telematics control units, and vehicle access key fobs. They support a wide range of wireless technologies — including GNSS L1/L2/L5/L6, ISM, Wi-Fi 6E, Bluetooth, cellular, LTE, 5G, and UWB — and offer frequencies extending from 617MHz to 8.5GHz. The surface-mount devices are also designed to deliver superior RF field containment for improved performance in reception-critical applications and available in stamped metal, FR-4, ceramic chip, and ultra-small chip packages, all of which are RoHS compliant.
Sleep buds reference design with active venting at CES 2024
xMEMS Labs unveiled a reference design tailored for the rapidly expanding sleep buds market.
The design incorporates xMEMS's patented Skyline DynamicVent technology, which offers enhanced comfort and automatic ambient control through a physical vent and DSP noise detection. Mike Housholder, xMEMS VP of Marketing and Business Development, explained the concept behind this innovative design: “Today’s sleep buds typically rely on noise masking sounds from a legacy coil speaker and noise blocking from a silicone or foam eartip. However, these eartips occlude the ear and amplify self-generated noises such as your own breathing, snoring or your ear rubbing against the pillow. Our Skyline DynamicVent leverages a noise-detecting microphone and DSP to vent the ear and reduce these occlusion effects that could disrupt sleep. But when outside noise is detected, the vent will close to achieve the best noise isolation. All told, this technology takes the sleep buds category to new levels of usability and more importantly, comfort.”
AMD revolutionised auto industry at CES 2024 with AI
AMD showcased automotive innovation at CES 2024 and expanded its portfolio with the introduction of two new devices, the Versal AI Edge XA adaptive SoC and Ryzen Embedded V2000A Series processor.
The devices underscore AMD automotive technology leadership and are designed to serve key automotive focus segments including infotainment, advanced driver safety, and autonomous driving. Working alongside a growing automotive partner ecosystem, AMD demonstrated at CES 2024 the broad range of capabilities and applications for these new devices in automotive solutions available today and in the future.
CES: Acquisition strengthens Intel’s hand in automotive
Intel announced plans at CES 2024 to drive the company’s AI everywhere strategy into the automotive market, including a deal to acquire Silicon Mobility, a fabless silicon and software company that specialises in SoCs for intelligent electric vehicle (EV) energy management.
Intel also announced a new family of AI-enhanced software-defined vehicle (SDV) system-on-chips (SoCs), with Zeekr as the first original equipment manufacturer (OEM) to adopt the new SoC to deliver its generative AI-driven living room experiences to next-generation vehicles.
CES: EarSwitch unveils in-ear communication device
EarSwitch, a startup using University of Bath research to develop wearable in-ear devices to help people with disabilities communicate, showcased a new product at CES 2024.
EarSwitch is a small, earbud-like device. Inserted into the ear, it uses an in-built sensor to detect movements of a tiny muscle known as the tensor tympani, allowing users to operate an assistive keyboard. An assistive screen scans letters and words that users can select by tensing the ear muscle.
CES 2024: SiLC unveils “groundbreaking LIDAR technology"
At CES 2024 in Las Vegas, SiLC Technologies (SiLC) unveiled the Eyeonic Vision System Mini (Eyeonic Mini). The company says it is a groundbreaking advancement in LiDAR technology.
The system integrates a full multi-channel FMCW LiDAR on a single silicon photonic chip and an integrated FMCW LiDAR System-on-Chip (SoC), and says SiLC, sets a new industry benchmark in precision.
Utilising the industry’s first purpose-built digital LiDAR processor system-on-chip (SoC), the iND83301 (‘Surya’) developed by indie Semiconductor, the Eyeonic Mini achieves an unprecedented level of detail, delivering an order of magnitude greater precision than existing technologies while being one-third the size of last year's pioneering model.
TI debuts new automotive chips at CES
Texas Instruments (TI) has launched new semiconductors aimed at enhancing automotive safety and intelligence. Among them is the AWR2544 77GHz millimetre-wave radar sensor chip, a product for satellite radar architectures in the automotive industry. This chip is integral in augmenting sensor fusion and decision-making in Advanced Driver-Assistance Systems (ADAS).
Additionally, TI has introduced new software-programmable driver chips, including the DRV3946-Q1 integrated contactor driver and DRV3901-Q1 integrated squib driver, designed to support functional safety in battery management and powertrain systems.
CES 2024: Orbbec-Hiwonder educational robotics partnership
Orbbec, an industry pioneer dedicated to 3D vision systems, announced a partnership with Hiwonder, a manufacturer of robots for the educational industry, at this year’s Consumer Electronics Show (CES). Hiwonder owns over 40 technical patents and its products are in more than 2,000 educational institutions to enhance STEAM (science, technology, engineering, arts, maths) education.
The partnership marks Orbbec’s entry into the educational robotics industry. Students can learn and experiment with robot operations, sensors, vision, mapping, navigation, and human-machine interactions. The JetHexa ROS Hexapod Robot Kit and the JetAuto ROS Robot Car have integrated Orbbec’s Astra+ 3D camera and are powered by NVIDIA Jetson Nano and support the open-source Robot Operating System (ROS). The platform leverages mainstream deep learning frameworks, uses OpenCV for image processing, incorporates MediaPipe development, enables YOLO model training, and utilises TensorRT acceleration.
Debut of AR glasses demo with plastic full-colour waveguide
Cellid unveiled new plastic full-colour waveguide for AR glasses at CES 2024.
The AR glasses are remarkably thin and lightweight, similar to weight and shape of regular eyeglasses. Cellid also showcased the latest Glass waveguide with the world's largest level of 60° field of view and crisp images with superior resolution. Cellid waveguide for AR glasses will accelerate widespread adoption of AR glasses for everyday use versus the current bulky AR glasses/VR headset.
NVIDIA drives AI forward with automotive innovation
An array of advanced technologies from NVIDIA’s automotive partners was showcased at the CES trade show in Las Vegas.
Mercedes-Benz kicked off CES with a press conference to announce a range of exciting software-driven features and the latest developments in the Mercedes-Benz MB.OS story, each one showcased in a range of cars, including the Concept CLA Class, which is using NVIDIA DRIVE Orin for the automated driving domain. Mercedes-Benz is also using digital twins for production with help from NVIDIA Omniverse, a platform for developing applications to design, collaborate, plan, and operate manufacturing and assembly facilities.
ADI, Honeywell team up for building automation
At CES 2024, Honeywell and Analog Devices (ADI) entered into a Memorandum of Understanding to explore the digitisation of commercial buildings by upgrading to digital connectivity technologies without replacing existing wiring, which will help reduce cost, waste, and downtime.
The strategic alliance would bring this new technology to building management systems for the first time.
Hyundai’s air mobility company debuts product concept at CES
Hyundai Motor Group's Advanced Air Mobility (AAM) division unveiled S-A2 at CES 2024, an electric vertical takeoff and landing (eVTOL) vehicle.
This pilot-plus-four-passenger vehicle is a progression from the S-A1 concept introduced in 2020, merging aerospace engineering with Hyundai's automotive design to revolutionise urban transportation. Supernal aims to offer a safe, efficient, and cost-effective air travel solution by 2028.
Siemens' industrial Metaverse: immersive engineering and AI
Siemens unveiled innovations that are combining the real world and the digital worlds to redefine reality as it opened CES 2024.
Siemens announced new partnerships and breakthroughs in AI and immersive engineering to enable the industrial Metaverse, and highlighted how these technologies are empowering the world’s innovators to thrive using its open digital business platform, Siemens Xcelerator.
Single-chip radar enables system solution for ADAS
NXP Semiconductors extended its automotive radar one-chip family to enable ADAS architectures for software-defined vehicles. The SAF86xx monolithically integrates a high-performance radar transceiver, a multi-core radar processor and a MACsec hardware engine for state-of-the-art secure data communication over Automotive Ethernet.
“It is aimed at software defined vehicle architectures,” says Matthias Feulner, Senior Director, ADAS at NXP Semiconductors.
To watch exclusive coverage of Eureka Park, the startups area at CES, then visit our sister title's website: Startups Magazine.
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Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
