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Electronic materials leadership to be showcased at electronica 2016

6th October 2016
Anna Flockett

 

Electronic products today are increasingly challenged to deliver high quality, exceptional reliability and affordability. Fundamentally, these expectations require materials that enable device protection, robust thermal control and reliable interconnects.

At electronica, in Munich next month Henkel will offer show delegates the opportunity to learn more about its suite of circuit board protection, thermal management and solder materials, all designed to enable the performance of modern-day electronic designs. 

Attendees are invited to take part in hands-on demonstrations, listen to informative presentations at the Exhibitor Forum and discuss the latest developments with Henkel technical experts at booth 361 in hall B1.

Circuit board protection systems

Assembly protection at the board level is essential to a product’s long-term operational reliability. Henkel’s broad portfolio of circuit board protection materials extends beyond protection alone, offering functional performance as well. The company’s TECHNOMELT product line, for example, now includes thermally conductive TECHNOMELT TC 50.

With the benefits of low pressure molding encapsulation also comes the ability to dissipate heat through the encapsulating layer to avoid overheating and increase reliability and operating time. Live molding demonstrations of TECHNOMELT TC 50 will take place in the Henkel booth.

Another hot melt innovation, TECHNOMELT AS 8998, provides a peelable, automated masking solution for conformal coating processes and is compatible with Henkel and other conformal coating materials. Elimination of manual taping processes speeds throughput, reduces process complexity and can lower annual material and labor costs by as much as 40%.

For PCB assemblies that require environmental safeguarding with added value, Henkel’s portfolio of potting materials delivers durable encapsulation and protection in addition to functional capability. With formulations that provide high temperature resistance, weight reduction and/or thermal conductivity, Henkel has a full range of potting systems to address numerous applications and performance requirements.

Robust thermal management solutions

As device dimensions have decreased in tandem with increases in functionality, thermal control has become more challenging. Henkel’s Gap Filler liquid dispensed materials allow for conformity to complex architectures, while offering an automated solution for high-volume environments. Well-suited for fragile, low-stress applications, Gap Filler materials are available in a variety of formulations including the self-leveling Gap Filler 1400SL and low-volatility Gap Filler 3500LV.

Next-generation solder technologies

Henkel’s solder development initiatives continue to be recognised with industry awards and customer validation. Recently, the superior performance of the company’s game-changing, temperature-stable LOCTITE GC 10 was proven in an independent, third-party study that compared it to three other commonly used solder paste materials.

Speak with the Henkel technical team about LOCTITE GC 10’s unprecedented stability both on and off the line, and learn more about the cost-saving, high performance benefits it provides.

 

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