YINCAE will showcase its latest innovations at SMTA International 2025, 21–23rd October, at the Donald E. Stephens Convention Centre in Rosemont, Illinois.
Visitors will explore cutting-edge solutions designed to address reliability, thermal management, and processing challenges in semiconductor, microelectronics, and PCB assembly applications.
Explore YINCAE’s technology:
- Underfill materials – Strengthen solder joints and improve thermal performance for fine-pitch, flip-chip, and advanced packaging, while simplifying assembly.
- Die attach adhesives – High-performance adhesives for optimal heat dissipation, mechanical stability, and durability in high-power, high-reliability devices.
- Board-level assembly materials – Solder pastes, adhesives, and encapsulants that boost yield, reduce defects, and enable precise, reliable PCB assembly.
- Wafer-level & optoelectronic materials – Materials for wafer-to-wafer, chip-to-substrate, and LED/optical device packaging that streamline production and enhance device performance.
- Thermal interface materials – Advanced TIMs for efficient heat transfer in AI, 5G, power electronics, and high-density assemblies.
YINCAE’s portfolio empowers manufacturers to push performance boundaries, enhance reliability, and improve production efficiency in next-generation electronics.
