The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3000 series films are tougher than most negative photo resists on the market with a glass transition temperature of 158°C and a moderate modulus of 3.5GPa at 25°C.
It is hydrophobic in nature, providing for chemical and moisture resistance. DF-3000 series films are compatible with and can be used in contact with the EMS line of spin coatable photoresists. Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of negative photoresists as well as conductive and non-conductive adhesives for semiconductor and circuit assembly applications.