The scalable EVA100 allows simultaneous control of multiple test functions to conduct high-precision measurements, improving test efficiency and time-to-market.
The company will also display its innovative CloudTesting Service, which offers cost-effective, on-demand test solutions to users working in semiconductor design, electronic component R&D, prototype evaluation, failure analysis and academic research.
Also featured in the booth will be the M4171 single-site handler that combines automated device loading and unloading and active thermal control (ATC) in a portable design ideally suited for use in an engineering environment.
On Wednesday, May 23 at 3:10 p.m., Dr. Shang Yang, Advantest senior R&D and application engineer, will present a paper on “3D Chip Defect Characterisation by High Resolution Time-Domain Reflectometry” during the IC Failure Analysis and Defects Characterisation Forum.
Advantest also has two papers featured in the Product & System Level Testing Forum on Thursday, May 24.
At 10:25 a.m., Ting Jia Wen, manager of Test Development Engineering at GLOBALFOUNDRIES Singapore will present a paper on “5G mmWave Future Testing Methodology at ATE Level” that was co-written by Advantest Business Development Manager Adrian Kwan.
At 11:05 a.m., Alvin Siew, Advantest staff application engineer, will present a paper on “Addressing the Robust Testing Needs of High-Power Analog ICs in Electric Vehicles.”
