Events News

ASMPT showcased power module solutions at PCIM

25th June 2024
Caitlin Gittins

At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution. 

The company demonstrated cutting-edge laser dicing and sintering technologies, addressing the needs of the automotive industry and beyond.

"Against the backdrop of recent supply chain challenges, the European automobile electronics industry has a great interest in having more chips and components manufactured in Europe. Power electronics in particular are developing great momentum, as was apparent at the PCIM show,” said Johann Weinhändler, Managing Director at ASMPT AMICRA in Regensburg, who is responsible for ASMPT’s Semiconductor Solutions segment in EMEA in addition to the global AMICRA business. “With our help, European EMS providers will conquer new business areas.”

David Felicetti, Business Development & Product Marketing Manager at ASMPT, added: “With their high efficiency and thermal conductivity, power modules that are based on silicon carbide (SiC) and firmly bonded to heat sinks via silver sintering are increasingly in demand for automotive electronics, but other application areas will play a significant role in the future as well. Accordingly, many PCIM visitors showed great interest in our POWER VECTOR die and module bonding platform. We can now offer machines for the complete process chain in power module production. This does not mean, however, that these machines must be arranged in a line, as in our model. I can well imagine that some EMS providers will specialise in process steps such as sintering.”

In line with its sustainability objectives, ASMPT chose not to transport large machinery to Nuremberg, opting instead to present its equipment through mock-ups and models, complemented by 3D video demonstrations.

Furthermore, the exhibition of the ALSI LASER1205 multi-beam laser dicing platform conveyed another vital message. With its patented new technique, this platform enhances the yield in the processing of thin, fragile, and still highly costly SiC wafers. The innovative system can handle wafers ranging from 10 to 250 microns thick with a positioning accuracy of less than 1.5 microns and operates 50 percent faster than traditional methods.


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