ASIC, SoC and SiP technology at EDS 2017
SWINDON Silicon Systems is to exhibit at the forthcoming Engineering Design Show (October 18-19, Ricoh Arena, Coventry - Stand H2) and will demonstrate the advantages of Application Specific Integrated Circuits (ASIC), System on Chip (SoC) and System in Package (SiP) solutions that are designed to be at the heart of intelligent sensing solutions.
An increasing number of companies are realising the many advantages these single package electronic systems can offer and SWINDON, already recognised for its design expertise and experience in the supply of mixed signal ASICs, will be at EDS 2017 to share its experience and help customers choose the right solution for their specific applications.
SWINDON is a regular exhibitor at the Engineering Design Show and, according to Director of Sales Richard Mount, past events have always attracted visitors keen to understand how their products can benefit from the integration of custom devices. “In fact, we have recently signed a major strategic agreement with Dukosi a battery management technology innovator, who we first met at EDS 2015,” says Richard Mount. “As a result, we are working with Dukosi to bring its disruptive semiconductor chip-based battery management solution to market. This latest major contract win for SWINDON proves once again that we are at the forefront of innovation and fast becoming the first choice for companies looking for an ASIC partner that will work with them from concept to volume supply.”
Members of the SWINDON team will be on hand at EDS 2017 to highlight the advantages of mixed signal ASIC / MEMS, SoC and SiP technology for existing and emerging markets, and provide an insight into SWINDON’s full turnkey semiconductor service that delivers optimized solutions to provide customers with a competitive edge, both technically and commercially.