Test Research, Inc. (TRI) will join the IPC APEX EXPO 2026 held at Anaheim Convention Center on 17-19th March, 2026.
TRI’s lineup will include the enhanced 3D SPI TR7007Q SII , the flagship 3D AOI TR7700Q SII, and the multi-angle 3D AOI TR7500QE Plus. TRI’s AOI are powered by TRI’s AI-powered inspection algorithms and metrology measurement capabilities.
TRI’s lineup will feature the new 3D AXI TR7600FB SII, which incorporates an X-ray imaging structure to address diverse product layouts and is optimised for specialised substrates, BGAs, multilayered structures, and SiP.
The TR7600FB SII is the ideal choice for inspecting critical components that need to be imaged with high resolution, as the system allows the tube to get exceptionally close to the board without structural interference. Also presenting at IPC APEX 2026 will be the high speed 3D AXI TR7600 SIII and the modular multi-core board tester TR5001 SII Inline.
TRI’s platforms are powered by TRI’s AI Ecosystem, which significantly improves inspection accuracy and efficiency. These AI-driven solutions achieve over 99% accuracy for common components, drastically reducing false calls. They also enable AI smart programming, which can reduce setup time by up to 85%. TRI solutions comply with the latest smart factory standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Visit TRI’s booth No. 2833 at IPC APEX 2026.
