Also on show will be a Wafer feeder available for different SMT placement systems and custom automation platforms. Single wafers are vertically loaded into the feeder, positioned automatically, then precisely located by a vision system. The DDf Innova may use either ink dot recognition or wafer mapping to ensure that only good die are extracted from the wafer frame. Using Direct Die Feeders from Hover-Davis lowers overall capital investment and reduces assembly costs.
Also on display will be Nortec high temperature masking labels made out of polyimide like the Nortec high temperature Identification Labels. These are constructed with different adhesives, which keep the labels on the PCB during wave soldering and reflow processes, but are still easily removableafter these processes. The labels can be used for masking parts of the PCB during wave soldering or also as placement like identification labels.
