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5G and AI test solutions set for SEMICON Japan

4th December 2019
Mick Elliott

Semiconductor test equipment supplier Advantest will exhibit a wide variety of its latest products and solutions at SEMICON Japan 2019 (December 11-13) at Tokyo Big Sight. Advantest’s exhibit will address the test challenges of advanced ICs that make 5G communication a reality and accelerate the development of other cutting-edge applications, from AI/machine learning and smart manufacturing to smart cities.

“This year’s product showcase will highlight our continuous efforts to contribute to the evolving semiconductor industry by expanding and enriching test and measurement solutions,” said Judy Davies, Advantest’s vice president of global marketing communications. “By reinforcing our core businesses and pioneering new activities, we will keep adding customer value across the semiconductor supply chain.”

In Advantest’s booth #2969 in West Hall 1, new product highlights will include the V93000 Wave Scale Millimeter solution, an integrated and modular multi-site millimeter-wave (mmWave) ATE test solution to cost-effectively test 5G-NR mmWave devices up to 70 GHz.

Two new modules and a test head compatible with the T2000 series test platform will be on show. These are designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles.

Also on parade is the MPT3000ARC, a test platform to combine thermal-control capability with high throughput, enabling extreme thermal testing of solid-state drives (SSDs) including PCIe Gen 4.

Among other products to be featured through demonstrations and digital graphic presentations are the EVA100 measurement system with HVI (high-voltage VI source and measurement) modules that extend the platform’s range to include high-power ICs used in large-volume consumer applications; the T5800-series memory testers providing end-to-end test solutions from wafer-level to final test; and the T5503HS2 system, which evaluates the advanced features of next-generation, high-speed LPDDR5 and DDR5 memory ICs.

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