The MV-6 is a compact 2D in-line AOI system.The system is configured with the company’s 10MP top-down camera, which features a 13.4µm telecentric compound lens and four 10MP side-view cameras to detect lifted leads and lifted components. The MV-6 is also configured with six-phase colour lighting for a more detailed detection of lifted leads and check solder paste deposits. The Intelli-Scan laser system is optionally available for use with gull wing devices and a four-point height measurement capability for co-planarity testing of BGA and CSP devices.
Also at the exhibition will be the MV-9 AOI system, which combines 2D inspection and 3D measurement in a single head. For 3D measurement, the system uses Shadow Free Moiré phase shift image processing. Equipped with a six-phase colour lighting system, the MV-9 utilises a high resolution, digital 15MP camera technology with telecentric lens. The system is also fitted with four 10MP side cameras and available with a 25MP camera and 7.7µm lens for components down to 03015.
Also on display will be the MS-15 in-line SPI system, which inspects solder paste depositions on PCBs post screen print, and the MV-3 Desktop AOI system, which is designed to automatically inspect for manufacturing defects both before and after reflow.