TSMC’s DCA program focuses on chip implementation service and system level design solution enablement to lower the design barrier for customers adopting TSMC technology.
EnSilica’s partnership with TSMC through the DCA program strengthens EnSilica’s value in enabling next-generation System-on-a-Chip (SoCs), ranging from mixed signal devices for industrial and automotive applications to communications and Edge AI chips using TSMC’s most advanced process technologies.
The TSMC Open Innovation Platform initiative is the industry’s most comprehensive design ecosystem that includes all critical integrated circuit implementation areas to reduce design barriers and improve first-time silicon success. OIP actively promotes the speedy implementation of innovation amongst the semiconductor design community, enabling semiconductor designers to harness TSMC’s leading process and 3DFabric technologies to reach an entirely new level of performance and power efficiency for next-generation artificial intelligence (AI), high-performance computing (HPC), and mobile applications.
Ian Lankshear, Chief Executive Officer of EnSilica, commented: “Joining the TSMC DCA program marks a significant achievement for EnSilica. Our deep expertise in mixed signal and RF design, combined with TSMC’s advanced technology, positions us to deliver unparalleled solutions to our mutual customers.”
Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC, commented: “We are pleased to welcome EnSilica to the TSMC OIP Design Center Alliance, providing value-added service and solutions in enabling semiconductor design using TSMC’s advanced process technologies. TSMC is committed to collaborating with our OIP ecosystem partners, including EnSilica, to empower customers in achieving their design goals and quickly bringing their innovation to market.”