Seica secures tech award for EV battery pack testing
Seica is delighted to announce its receipt of the 2023 Global Technology Award in the Test Equipment category.
The award was presented during productronica in Munich, Germany, on Tuesday, 14th November 2023.
This recognition celebrates Seica's significant contribution with the Pilot BT, a notable development in electric vehicle (EV) battery pack testing. The Pilot BT sets a benchmark in the EV battery assembly sector for its rapid testing capability, evaluating over 2,400 battery cells in parallel groups for 100% test coverage in under a minute.
The fully automated Pilot BT system is expertly designed for comprehensive testing of full-size EV battery packs with various chemistries. As electric vehicles extend across numerous transport forms, including cars, buses, trains, and airplanes, the Pilot BT addresses the diverse requirements of battery manufacturers. It features a large testing area of 1,050mm x 865mm (41.33'' x 34.05''), accommodating different shapes and electrical characteristics of battery packs, with options for Seica's conveyor system or customised solutions according to client preferences.
Building on Seica's established reputation, this second-generation electric vehicle battery tester offers capabilities essential for the evolving EV market. It is notable for its speed, parallel test capacity, precise measurements, reliable mechanics, thorough quality assurance, and ease of use. The Pilot BT includes advanced test electronics, accurate battery cell probing, robust mechanical and electronic components, and a user-friendly software GUI, fully integrated with Factory 4.0 automation and MES systems.
A key feature of the Pilot BT is its innovative design as a Commercial Off-The-Shelf (COTS) solution, ready for rapid deployment. Seica's adaptable approach allows customers to choose their preferred conveyance solutions, whether Seica's system or another reputable automotive conveyance platform.
Since 2005, the Global Technology Awards have acknowledged leading innovations in the printed circuit assembly and packaging industries. These prestigious awards unite the global SMT and advanced packaging industry in recognising companies and individuals who set high standards and drive the industry forward.