Indium earns award for Durafuse HR alloy

Established in 2006, the EM Asia Innovation Award program recognises and celebrates excellence in the Asian electronics industry, incentivising companies to achieve the highest standards and push the industry forward. The awards are based on strict criteria, including innovativeness, cost effectiveness, and technology advancement.

“We’re always honoured to be recognised by industry peers for our innovative advances in materials science,” said Ross Berntson, President and CEO, Indium. “Our dedicated team of engineers developed Durafuse HR in close collaboration with our customers in the semiconductor and e-mobility industries, among others, identifying inventive ways to address many of their electronics assembly needs and challenges.”

Durafuse HR is a high-reliability solder alloy developed from Indium's Durafuse mixed-alloy technology. Engineered to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, Durafuse HR is designed specifically for the rigorous demands of automotive electronics and other high-reliability applications. It is well suited for manufacturers transitioning from SAC305, requiring only minimal process adjustments for easy implementation.

Among its key features, Durafuse HR offers:

• Exceptional thermal cycling reliability, withstanding 3,000+ cycles at -40°C–125°C
• Reduced bottom-terminated component (BTC) voiding, even without vacuum reflow
• Superior shear strength for increased durability and reduced solder joint cracking
• Seamless compatibility with SAC305 reflow profiles and common PCB surface finishes (ImSn, OSP, ENIG)
• Optimised yield rates and reliability, reducing defects, rework, and overall production costs