Heraeus receives global technology award
Heraeus Electronics has announced its receipt of the ‘2023 GLOBAL Technology Award’ in the category of Solder Paste.
This award recognises the contributions of Heraeus Electronics' Microbond SMT660 Innolot 2.0 solder paste, announced during an award ceremony at productronica in Munich on 14th November 2023.
Microbond SMT660 Innolot 2.0 solder alloy advances automotive industry
The Microbond SMT660 Innolot 2.0 solder alloy is transforming the automotive industry's approach to reliable and cost-effective solder alloys. This solution provides manufacturers with the ability to maintain competitive Total-Cost-of-Ownership (TCO) while meeting emerging industry requirements.
Performance and reliability
The Microbond SMT660 Flux, used with either the Innolot or the new Innolot 2.0 alloy, delivers notable performance and reliability, demonstrating Heraeus’ dedication to innovating bonding materials in the automotive electronics sector.
Reflow performance of Microbond SMT660 Series
The Microbond SMT660 Series is recognised for its reflow performance, notably in the reflow process without the need for additional nitrogen (N2). This characteristic significantly reduces defect rates and contributes to a lower Total-Cost-of-Ownership (TCO) for manufacturers. Heraeus Electronics' innovation aligns with the industry's pursuit of reliability and cost-efficiency, making the Microbond SMT660 Innolot 2.0 solder alloy a valuable asset for the automotive sector.
Global technology awards
The GLOBAL Technology Awards, established in 2005, are seen as an industry benchmark, acknowledging high standards and innovative solutions within the global SMT and advanced packaging industry. The award recognises companies and individuals who consistently contribute to the industry with their innovations.