The award recognises Heraeus Electronics’ contribution to the automotive industry with its Microbond SMT660 Innolot 2.0 Solder Paste. The award was announced during a ceremony that took place 25th October 2023 during the SMTA Guadalajara Expo in Mexico.
Heraeus Electronics’ Microbond SMT660 Innolot 2.0 solder alloy is innovating the automotive industry’s approach to highly reliable and cost-effective solder alloys. This solution empowers manufacturers with the ability to maintain a competitive Total-Cost-of-Ownership (TCO) while satisfying emerging industry requirements.
“The Mexico Technology Award is a testament to Heraeus Electronics’ dedication to driving innovation and excellence in the automotive industry,” stated Manu Vaidya, Global Product Manager at Heraeus Electronics. “Our Microbond SMT660 Flux in combination with either the well-known Innolot or the new Innolot 2.0 alloy delivers exceptional performance and reliability, further solidifying our commitment to innovating bonding materials in the automotive electronics landscape.”
At the core of Heraeus Electronics’ victory is the Microbond SMT660 Series remarkable high creep resistance. This feature translates to extended product life cycles even when subjected to higher operating temperatures.
One of the standout features of the Microbond SMT660 Solder Paste Series is its exceptional reflow performance. Notably, this solder paste excels in the reflow process without the need for additional nitrogen (N2), effectively minimising defect rates and contributing to a reduced Total-Cost-of-Ownership (TCO) for manufacturers.
