Adeia’s RapidCool Technology has been shortlisted for the Electronics Excellence Awards under the Semiconductor category.
Adeia’s RapidCool is an advanced semiconductor packaging technology that uses direct-to-chip liquid cooling to efficiently remove heat from high-power integrated circuits during operation.
By eliminating traditional thermal interface materials (TIMs), RapidCool reduces thermal resistance and improves heat transfer efficiency. Its optimised microchannel architecture enables effective heat extraction at very high power densities, supporting next-generation processors and accelerators used in AI and high-performance computing applications.
The design enhances overall cooling performance while significantly lowering pressure drop compared to earlier microchannel approaches, enabling practical system integration. By maintaining lower junction temperatures, RapidCool helps improve device reliability, sustain higher performance, and enable greater power density within compact system footprints. The cold plate and integrated manifold can be customised to target the cooling performance in hot spot regions, unlike the incumbent Cu cold plates.
For more information, visit: https://adeia.com/blog/hybrid-bonding-and-direct-to-chip-cooling-with-roth-capital-partners
The Electronics Excellence Awards ceremony will take place at embedded world on 11th March at 4.30pm at the Hall 5 Forum.
You’re all welcome to come and see which product will win!
