Accordingly, even the slightest contaminants remaining on the surface are impede the reliability required in these critical and highly sensitive applications.
To guarantee the highest cleanliness and process reliability, the contaminants must be removed from the substrate and chip surfaces through an optimally adjusted cleaning process. Therefore, ZESTRON will present the latest generation of cleaning agents specifically developed for power modules at PCIM.
Zestron has already implemented several processes in this area and is ready to support you with the selection or optimization of your power module cleaning application. Visit us at PCIM (Hall 7, Booth # 236) in Nuremberg!