Rozalia will work with a team of talented analysts dedicated to furthering Yole Développement’s growth.
Ms. Beica comments: “I am delighted to join Yole Développement. I have always admired Yole for its market & technology analysis, and its perspectives on technology, supply chain activities and market research. I am very excited to have the opportunity to join this bright team, and I look forward to helping Yole Développement grow while providing all necessary support to our customers and industry.”
For over 15 years, Rozalia has been involved in the research, strategic marketing and application of WLP and 3D/TSV at material, equipment and device manufacturing organizations. She’s worked at Rohm and Haas, Semitool, Applied Materials, Lam Research and Maxim IC. Throughout her career, Rozalia has been very involved with industry activities: she’s authored 50+ papers and publications, spoken at industry conferences, chaired 3D committees and continues to support several 3D & Advanced Packaging Committees worldwide.
Rozalia has an M.Sc in Chemical Engineering (Romania), an M. Sc. in Technology Management (USA) and a Global Executive MBA from IE Business School (Spain).
“Rozalia’s joining of Yole Développement as CTO and Business Unit Director, Advanced/3D Packaging and Semiconductor Manufacturing, is a big step forward for the company. Rozalia brings outstanding knowledge in Advanced Packaging via experience gained with chip manufacturers and equipment suppliers. It is my pleasure to partner with her and the executive team, and lead Yole Développement’s future growth,” commented Christophe Fitamant, Yole Développement’s Sales and Marketing Director.