Invensas Shows New xFD Customer Products at Computex Taipei

We are very excited by the early rate of xFD adoption in the marketplace, said Simon McElrea, president of Invensas Corporation. Since we launched the platform only 18 months ago, we have witnessed a steady stream of adopters at the system, chip and contract manufacturing levels.

The xFD, or multi-chip face-down semiconductor packaging solution, mounts the memory chips in an upside-down shingle-stack configuration, and then uses ultra-short wire-bonds to connect the chips to a Ball Grid Array (substrate. Multiple configurations of chip stacks are possible: in one version, Double Data Rate DRAM chips are stacked to produce enterprise solutions for network and datacenter products, in another, Mobile DRAM chips are stacked to produce solutions for tablets and Ultrabooks. In all cases, the solutions significantly reduce component size (by up to 75%), increase bandwidth, speed and power performance (by greater than 50%) and reduce total system cost.

Invensas' model of close collaboration with our customers and supply chain partners ensures that our valuable patented solutions are not just licensed, but implemented successfully in high volume, royalty-generating production, McElrea continued. Our customers' success is our success, and we are delighted at the rapid early adoption of xFD.