New X-Plane Technology from Nordson DAGE Earns a 2012 Innovation Award during NEPCON China

27th April 2012
ES Admin
Nordson DAGE announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its new X-Plane Analysis – Sub Micron X-Ray Inspection System Option. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China.
Phil Vere, President Nordson DAGE, commented, “We are delighted with this award which reflects the investment we at Nordson DAGE continue to make in the technology and usability of our systems to truly add value to our customers.”

X-Plane is a revolutionary option for Nordson DAGE’s range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane technology is quick, simple and easy-to-use.

The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.

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