The ADP utilizes an OpenVPX development chassis that supports conduction-cooled payload modules, an OpenVPX backplane, and air-cooled RTMs. The same conduction-cooled 3U VPX modules used in the lab development platform can be utilized in the deployed system. As a result, software developed on the ADP will run on the deployed system, reducing schedule risk and increasing the Test Readiness Level (TRL) of the deployed system.
The ADP features include:
• OpenVPX development platform with a development power supply, an RTM bay, and ten one-inch pitch slots for 3U conduction-cooled modules
• 3U OpenVPX backplane with eight payload slots, two switch slots, and two power slots
• 3U VPX Single Board Computer (SBC) based on the Intel Core 2 Duo, Intel Core i7, Freescale MPC8640D, MPC8572E, P2020, or P4080 processor
• Optional payload modules:
o 3U VPX PCI Express and Gigabit Ethernet integrated switch
o Avionics level (+28V), eight channel, isolated GPIO XMC
o Eight, dual redundant, MIL-STD-1553 channels PMC
o Four, dual redundant, MIL-STD-1553 channels, sixteen receive and six transmit ARINC 429 channels PMC
o MIL-STD-188-203-1A (ATDS) interface PMC
o Multi-protocol four port serial PMC
o 80 GB SSD XMC or 128 GB removable SSD storage module
• Operating system BSP and drivers for all VPX and mezzanine modules
“Our first ADP customer is saving six months in their development schedules,” said Bret Farnum, VP of Sales for X-ES. “This level of integration in a lab system gives customers a 100% functional duplication of their flight hardware and provides tremendous value to customers developing avionics systems.”
”While a customer’s software development is taking place on the ADP, X-ES can leverage existing designs and expertise to develop a custom ATR chassis, backplane, and power supply for their deployed system,” adds Jeff Porter, Lead Systems Engineer at X-ES. “A customer’s ADP card set can easily migrate to our deployable XPand3200 or XPand4200 ½ ATR chassis designs.”