Analysis

Texas Instruments collaborates with Continuous Computing and mimoOn for HSPA and LTE femtocells

23rd June 2009
ES Admin
0
Texas Instruments has announced the selection of Continuous Computing, a leader in wireless protocol software, and mimoOn GmbH, a leader in software defined radio solutions, as third parties to offer integrated solutions for HSPA and LTE enterprise and residential femtocells.
Continuous Computing’s Trillium software, and mimoOn’s mi!Femto advanced femtocell software, will be integrated onto TI’s TMS320TCI6485 residential femtocell processor and TMS320TCI6489 enterprise femtocell processor in order to offer both single and multimode solutions for LTE, HSPA+, and HSPA.

Trillium wireless software from Continuous Computing leverages over 20 years of innovation and consists of a complete protocol solution for the dynamic femtocell access point and femtocell gateway markets. Trillium femtocell software meets the unique requirements of network equipment providers and features comprehensive protocol stack support covering LTE & WCDMA, optimized data and control plane performance, and minimized memory footprint. This powerful and comprehensive offering enables customers to reduce project risk, cost, and complexity while accelerating time-to-market.

“Continuous Computing has been aggressive in tailoring access point software and femtocell gateway solutions for traditional as well as non-traditional vendors,” said Manish Singh, vice president of product line management. “Trillium femtocell software plus TI DSP femtocell processors equals a compelling combination for equipment manufacturers to participate in the exciting femtocell market. With Continuous Computing and TI, customers can have high confidence in performance, interoperability, portability, and support.”

The mi!FemtoLTETM and mi!FemtoHSPATM software families encompass both H(e)NB PHY and Protocol Stack layers, that are full-featured and certified based on the latest versions of the 3GPP standards. Both software packages are written in high level language andin modular form so they are easy to modify or customize even after beingdeployed; an important feature as the standards and operator requirements for femtocells continue to be revised.

According to mimoOn’s CEO, Thomas Kaiser, “This collaboration is significant in that TI brings its longstanding presence in the wireless base station market along with robust DSP processors, while mimoOn brings its legacy of MIMO algorithms, cognitive radio sniffers, and advanced schedulers, to offer innovative solutions for the key challenges in femtocells. This joint technology solution for single and multimode femtocells will be a strategic advantage for operators and OEMs that are looking to deploy femtocells in 2010 and beyond.”

The integrated implementation on the femtocell-optimized TCI6485 and TCI6489 will provide high performance, extremely low power consumption, and headroom for the advanced processing required for LTE and HSPA, as well as offer multi-user support. High channel bandwidths, multiple MIMO configurations, FDD/TDD, and high data rates will all be supported. This software-based femtocell design delivers a turnkey solution to OEMs that allows fast time-to-market, a reduced bill-of-materials, and the ability to evolve with future market requirements. To learn more about TI’s family of residential and enterprise femtocell solutions, please visit: www.ti.com/femto-3ppr-landing

“Time-to-market and robust performance are key considerations for service providers and equipment manufacturers in successfully deploying femtocell products and services,” said Kathy Brown, business manager for TI’s wireless baseband infrastructure group. “The integration and testing of the standards-compliant HSPA and LTE software from Continuous Computing and mimoOn with TI’s DSP programmable femtocell platform, achieves performance with the ability to differentiate, while offering a rapid vehicle to market.”

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier