STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as chip-on-board (COB) and multichip module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).
STI Electronics to Feature Key Engineering Services at Space and Missile Defense Conference and Exhibition
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Space and Missile Defense Conference and Exhibition, scheduled to take place August 15-18, 2011 at the Von Braun Center in Huntsville, AL.