SoC and SiP technology at Engineering Design 2016

9th August 2016
Peter Smith

At this year's Engineering Design Show, SWINDON Silicon Systems will be highlighting the new accessibility of System on Chip (SoC) and System in Package (SiP) solutions for automotive and industrial sensor interface applications as part of a mixed signal ASIC development and supply project.  

Visitors to the show will be able to discuss their individual requirements and how these highly integrated single package systems can enhance their future products and benefit their customers. As technology advances and becomes more accessible, this in turn opens up more opportunities for companies to use mixed signal ASICs, SoCs and SiPs in their development projects. SWINDON is committed to helping companies understand how this technology will give them the competitive advantage. Visitors are encouraged to meet the team at the show to discuss the ASIC solutions available for their existing and future drivers, developments and applications. 

Highlighting advantages such as higher performance, lower power consumption, increased reliability and the ability to minimise the footprint of future products, engineers from SWINDON will be on hand to share their experience and help customers choose the right solution for their particular applications. 

Product Spotlight

Upcoming Events

View all events
Latest global electronics news
© Copyright 2024 Electronic Specifier