Chamberlain will take responsibility for bringing Polar’s new and updated portfolio of signal integrity products to customers throughout the world. A vital part of the launch process for these products will be the dialogue with lead customers which will help to ensure a smooth transition from the release of the engineering version to full roll-out into the marketplace.
“Channelling and prioritising feedback during the launch phase of a new product or product upgrade is vital,” states Chamberlain. “I will be talking extensively to customers to ensure that the products provide easy and cost-effective answers to the real-world signal integrity issues faced by OEM designers and PCB fabricators.”
Polar’s CEO, Martyn Gaudion, adds; “Having been with Polar for 10 years, Neil has extensive experience in the PCB layout and fabrication process. This experience will help customers to address the emerging trend towards multi-GHz PCBs which is imposing new benchmarks for signal integrity.”
As part of a continual development process, Polar Instruments has recently extended the functionality of the Speedstack PCB layer stack-up design system with the introduction of a Virtual Material Mode which allows PCB layers to be designed without reference to material libraries. The addition of the Speedflex controlled impedance layer stackup design system for flex-rigid PCBs to the Speedstack system is another product milestone and further product updates are planned for 2011.