The wafer singulation technology utilised in Plasma-Therm’s recently released MDS-100 enables a significant reduction of kerf widths and addresses the limitations of saws and laser techniques for thin and ultra-thin silicon wafers. ON Semiconductor is using the Plasma-Therm MDS-100 die singulation solution for production of its latest semiconductor devices. The benefit for a semiconductor manufacturer such as ON Semiconductor is higher yields and more active silicon per wafer.
Dr. Hans Stork, Senior Vice President and CTO, ON Semiconductor, commented: “ON Semiconductor and Plasma-Therm co-developed a unique die singulation tool that utilises a novel singulation approach patented by ON Semiconductor. Under the terms of our new agreement, Plasma-Therm can now offer advanced die singulation equipment which utilises ON Semiconductor’s patented process technology.”
“Plasma-Therm has been able to develop an important production-worthy solution for plasma dicing as a result of our co-development of this die singulation tool and our cross licensing agreement with ON Semiconductor. This collaboration has yielded a Plasma Dicing system that utilizes standard tape frames and tape that allows the quick adoption into production lines,” comments Abdul Lateef, CEO, Plasma-Therm.